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3D camera with GMSL/FAKRA connector in a waterproof and dustproof housing.

Recommended for automatic transport systems and in-vehicle systems that support broadband communication.

This is a stereo-based depth camera that supports both long-distance and high-precision applications for indoor and outdoor use. Both the RGB and depth sensors use a global shutter type, allowing for higher quality 3D scans. The optimal range of the built-in camera is 6m (with a maximum depth of 20m), and it has a wide field of view of 86°, enabling developers to utilize it in designing vision-based solutions. It features an IP65 waterproof and dustproof housing with FAKRA/GMSL connectors, making it an ideal model for use in autonomous driving systems, driver assistance systems, and infotainment (IVI, in-vehicle infotainment) applications.

  • Sensors

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Embedded board with 11th generation CPU UP Xtreme i11

AAEON 11th Generation Core i7/i5/i3/Celeron equipped compact CPU board 120.35 x 122.5 mm

Features: ● Equipped with 11th generation Tiger Lake Intel(R) Core(TM) i7/i5/i3/Celeron(R) ● DDR4 SO-DIMM x2 slots (up to 64GB) ● 40-pin HAT connector ● Supports independent 4-screen display ● M.2 3052 B key slot available for 5G module installation ● M.2 2280 slot available for AI module installation ● M.2 2230 slot available for WiFi module installation ● Supports USB 4.0

  • Industrial PCs

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UP Xtreme i11 Edge Enabling Kit

AAEON AI development kit with 11th generation Core i7/i5, pre-installed with Ubuntu 20.04, Open VINO, and other software.

Features: ● Equipped with 11th generation Tiger Lake Intel(R) Core(TM) i7/i5 ● 16-pin GPIO connector x 1 ● 2.5Gbps LAN x 1 + 1Gbps LAN x 1 ● 8GB memory with 2 modules ● 128GB SATA SSD ● USB4.0 compatible ● M.2 2280 M key x 1, M.2 2230 E key x 1, M.2 3052 B key x 1 ● AI module equipped models available (UPX-EDGE-TGLI5-16128-FDAI, UPX-EDGE-TGLI7-16128-FDAI) For more details, please refer to the datasheet.

  • Industrial PCs

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Industrial COM Express Module [COM-MTHC6]

AAEON Industrial COM Express Module equipped with Intel Core Ultra series.

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

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  • Embedded Board Computers

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Industrial AI Board [BOXER-8654AI-KIT]

AAEON NVIDIA Jetson Orin NX equipped industrial AI board Jetpack 6.0 MIPI connectors x2

Features: ● Equipped with NVIDIA Jetson Orin NX 8GB/16GB ● CPU: Orin NX 8GB: 6-core Arm Cortex-A78AE ARMv8.2 64-bit, Orin NX 16GB: 8-core Arm Cortex-A78AE ARMv8.2 64-bit ● MIPI Connector x2 ● Onboard memory 8GB/16GB, 128GB storage (M.2 2280 M-Key) ● M.2 2230 E-Key x1 (Wifi/BT), M.2 2242/3042/3052 B-Key x1 (SIM onboard) ● Compatible 40-pin header with NVIDIA Jetson Orin Nano Developer Kit ● PoE connector, FAN connector included ● Wide range DC input power supply from 12V to 24V ● TPM 2.0 support via jumper selection ● Jetpack 6.0.0 pre-installed

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  • Industrial PCs

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12th/13th Generation CPU Compatible PC BOXER-6645-ADS

AAEON 12th/13th Generation CPU Compatible Chipset H610E/Q670E Industrial Fanless PC

Features ● Supports 12th/13th generation Intel(R) Core(TM) i9/i7/i5/i3/G6900TE/G6900E processors (sold separately) ● DDR5 SODIMM x 2 slots (up to 64GB) (sold separately) ● HDMI x 2, DP x 2 ● M.2 3052 (for 5G module) ● GbE x 3, 2.5GbE x 1 ● Compatible with Windows 11 ● CPU, memory, storage, OS not included

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  • Industrial PCs
  • Embedded Board Computers
  • controller

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Industrial 3.5-inch Standard Single Board PC [MF32]

JETWAY 13th Generation Intel Core i5-1335UE and Celeron U300 equipped 3.5-inch SBC

Features: ● Equipped with Intel 13th generation Intel Core i5-1335UE and Celeron U300 ● DDR5 4800MHz SO-DIMM x1 (up to 32GB) (sold separately) ● 2.5GbE LAN x4 ● PoE output x2 compliant with 802.3at ● SATA x1, M.2 E-key x1, M.2 M-key x1, M.2 B-key x1 (with Nano SIM card slot) ● USB 3.2 Gen 2 x2, USB 2.0 x4, COM port x2 ● Integrated fTPM, also supports external TPM as an option ● Wide operating temperature range: -20 to 60℃ * Memory, storage, and OS not included

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  • Embedded Board Computers

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Industrial Mini ITX Standard Motherboard 【MIX-H610A2】

AAEON 12th/13th/14th Generation Core i Compatible Industrial MiniITX Motherboard with LGA1700 Socket

Features: ● Supports 12th/13th/14th generation Core i with H610E chipset LGA1700 socket (maximum TDP 65W) (CPU sold separately) ● DDR4 3200MHz U-DIMM x 2 slots (maximum 32GB) (memory sold separately) ● HDMI 1.4 x 1, DP 1.4 x 1 ● M.2 2280 M-Key x 1, M.2 2230 E-Key x 1 ● USB 3.2 x 4, USB 2.0 x 4 ● Realtek RTL8111H Ethernet x 1 ● SATA 6Gb/s x 2 ● PCIe [x16] slot x 1 ● Compatible with ATX power supply * CPU, memory, storage, and OS are sold separately.

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  • Embedded Board Computers

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Iron927 IMX927 equipped CoaXPress camera

Kaya Vision has announced the IMX927 camera.

Iron927 is a CoaXPress CXP-12 4lane camera equipped with Kaya Vision's (Kaya Instruments) IMX927. It can output a maximum of 46fps at 10240x10240 resolution. System construction example: Using Kaya Instruments' 8lane frame grabber KY-FGK-III-8ch, a 100Gbps class system was built with two Iron927 cameras. The system was constructed with Terasic's S10-Holoscan Holoscan Sensor Bridge and Kaya's FMC-II-CXP mezzanine card, connecting one Iron927 to Jetson Thor via a 100Gbps interface.

  • Other electronic parts
  • Color camera
  • Monochrome camera

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OpenVINO Toolkit

Fully unleash the performance of various accelerators! OpenVINO for AI accelerators.

The "Open Visual Inference & Neural Network Tool Kit" is based on CNN and maximizes performance by extending Intel's hardware. It converts deep learning models such as Caffe, MXNET, and TensorFlow into IR (Intermediate Representation) binary files, optimizes the IR, and then executes the inference engine. This engine operates across different processors, including CPU, GPU, Intel Movidius, and FPGA. An AI application is not complete with just the learning model. The development of real-time edge devices is crucial. *For more details, please refer to the PDF document or feel free to contact us.*

  • Development support tools (ICE, emulators, debuggers, etc.)
  • Software (middle, driver, security, etc.)
  • Other embedded systems (software and hardware)

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